SD NAND is an integrated embedded storage solution that combines MLC NAND Flash, a controller, and firmware in a BGA package. It provides high reliability, stable performance, and simplified system integration, making it ideal for IoT, wearables, and other space-sensitive applications requiring robust data storage.
SD NAND is a surface-mount, embedded flash memory chip in a compact LGA-8 package. It replaces removable cards for reliable, high-performance storage in IoT, industrial, and automotive electronics.
Every SD NAND flash chip we ship has been verified through automated electrical testing, full-capacity write validation, and thermal screening at our Yangzhou, Jiangsu facility. What leaves our factory is a production-ready component: correctly characterised, correctly graded, and traceable back to its NAND flash lot.
Printers & Multifunction Devices
Firmware storage, font libraries, user configuration data, job queues. The LGA-8 footprint enables thinner print engine board designs without sacrificing onboard storage reliability. 8GB capacity is sufficient for large corporate firmware images and embedded font sets.
Security Cameras & Smart Surveillance
Edge-buffered video frames, event logs, AI inference model weights, and local recording for fail-safe modes when network connectivity is lost. 32GB and 64GB variants provide meaningful local storage for edge-AI camera nodes without requiring a physical SD card slot — critical for weatherproof or tamper-resistant outdoor camera housings.
Smart Home Appliances
Refrigerators, washing machines, air conditioners, and smart ovens use SD NAND flash for feature configuration storage, firmware update staging, and usage logging. The permanently soldered format eliminates the maintenance cost associated with physical card slots in appliances that undergo vibration during normal operation.
Industrial Automation & Control
PLC firmware, parameter tables, alarm logs, and recipe data for manufacturing control systems. SLC-grade SD NAND flash in industrial temperature rating provides the endurance and thermal resilience required for always-on factory automation deployments.
Wearables & Compact Consumer Devices
Fitness trackers, smart glasses, hearables, and portable medical devices where PCB area is measured in mm² benefit from the 8.5×7mm footprint. The LGA-8 package is compatible with 0.1mm precision SMT placement equipment widely available in modern PCBA factories.
Automotive Interior Electronics
TPMS controllers, in-cabin ambient lighting controllers, seat/mirror position memory modules, and low-power telematics nodes that require embedded firmware storage without the connector reliability concerns of socket-based storage.
Every SD NAND flash chip produced at Ruixin Microelectronics passes through a mandatory multi-stage quality gate before shipment:
Stage 1 — NAND Flash Lot Incoming Inspection
Stage 2 — Assembly & Reflow
Stage 3 — Electrical Parametric Testing (100%)
Stage 4 — Endurance Screening (Sample-Based per Batch)
Stage 5 — Thermal Screening (Industrial Grade)
Stage 6 — Final Outgoing QC & Packaging
Q: What is the difference between SD NAND flash and a standard raw NAND flash chip?
A:Raw NAND flash requires the host processor to implement all flash management functions: ECC calculation and correction, bad block table maintenance, wear leveling algorithms, and write sequencing. This adds significant firmware complexity and requires intimate knowledge of NAND flash behavior from your MCU development team. SD NAND flash handles all of this internally via its embedded controller — the host sees a standard SD storage device and communicates through simple read/write block commands. The design-in complexity reduction is substantial, particularly for resource-constrained MCU platforms.
Q: Does SD NAND flash support SPI mode in addition to SD mode?
A:Yes. The LGA-8 SD NAND flash supports both 4-bit SD/SDIO mode and SPI mode (using DAT0 as MISO, CMD as MOSI, CLK as SCK, and DAT3 as /CS). SPI mode offers lower transfer speeds than 4-bit SD mode but provides compatibility with MCUs that have SPI peripherals but no native SDIO controller. Note that SPI mode performance is significantly lower — typically 2–5 MB/s vs 12.5–25 MB/s in SD mode.
Q: What is the difference between this SD NAND flash product page and your SD NAND category page?
A:The SD NAND category page covers technology overview, SD NAND vs eMMC vs TF card comparison, PCB design guidelines, and MCU compatibility information — useful for engineers who are still evaluating whether SD NAND is the right solution for their project. This page provides specific product parameters, NAND cell type options, controller firmware specifications, quality assurance details, and ordering information for engineers who have already decided on SD NAND and need component-level data to complete their design.
Q: Can the SD NAND flash chip be used in Linux-based embedded systems as the boot device?
A:Yes, provided your SoC/processor has an SDIO or SDMMC peripheral and your bootloader supports SD boot. The chip presents itself as a standard SD block device to the OS. U-Boot, GRUB, and most embedded bootloaders support this without modification. For Linux root filesystem usage, ensure your partition layout and filesystem (ext4 is recommended over FAT32 for Linux) are correctly configured during your OS image generation.
Q: What is your typical lead time for SD NAND flash orders?
A:Engineering samples: 5–7 business days. Standard commercial-grade production orders: 15–25 days from PO confirmation. Industrial-grade production with thermal screening: 20–35 days. Long-term blanket orders with scheduled releases can be arranged for customers with predictable annual volume requirements.
Q: Is there a minimum order quantity (MOQ)?
A:We offer engineering sample kits (typically 5–20 pieces) for qualified hardware development projects at no or nominal cost. Small-series production orders are accommodated. Volume pricing tiers apply to orders above 1,000 units, with further discounts for 5,000+ and 10,000+ unit annual volumes. Please contact our sales team for a current pricing schedule.
Q: How does SD NAND flash compare to your BGA eMMC products?
A:Our BGA product line covers higher-capacity (64GB–512GB) embedded storage based on the eMMC interface — designed for application processors that require large OS and application storage. SD NAND flash is the right choice when your MCU speaks SDIO rather than eMMC, your storage requirement is in the 8GB–128GB range, or your BOM cost target favours the simpler LGA-8 format over a full eMMC solution. For very small capacity requirements (128MB–8GB), please also refer to our SD NAND product overview for guidance on selecting the appropriate capacity tier.
To expedite your design-in process, we provide free engineering samples and full technical documentation for qualified projects. When submitting your request, please include:
Target capacity (8GB / 32GB / 64GB / 128GB)
NAND cell type (MLC standard / SLC high-endurance)
Temperature grade (Commercial 0–70°C / Industrial -40–85°C)
Interface mode (SD 4-bit / SPI)
MCU / SoC platform (for firmware compatibility pre-check)
Application description (for appropriate technical guidance)
Estimated annual volume (for pricing and production planning)
Our application engineering team will respond within 24 business hours with datasheet, PCB footprint files, and a sample dispatch confirmation.
1.Stronger Reliability
Soldered connection resists shock, vibration, and disconnection, outperforming removable cards.
2.Space Efficiency
Ultra-compact chip-scale package saves crucial PCB space in miniaturized designs.
3.Simplified Design
Eliminates card slots, reducing mechanical parts, costs, and failure risks.
4.Embedded Integration
Enables seamless, permanent storage directly on the device's mainboard.
1.High Durability
Direct SMT soldering provides excellent resistance to shock, vibration, and connection failure.
2.Compact Form Factor
Its chip-scale LGA package offers an ultra-small footprint and low profile.
3.Simplified Integration
Eliminates mechanical card slots, reducing board complexity and potential points of failure.
| Parameter Name | Description and Impact |
| Manufacturing process | Integrates NAND flash and controller into a single chip package. |
| Capacity range | 8GB,32GB,64GB,128GB |
| Size and packaging | packaging form: may vary depending on application requirements. |
| working voltage | 2.7V - 3.6V |
| Application scene | smart appliances, printers, security cameras |
| Data retention | >10 years at room temperature |
| ECC error correction | built-in hard error correction (BCH ECC) |
| Bad block management | automatic global equalization wear algorithm |
| Data transmission speed | up to 25MHz (Class 10) |
In summary, An embedded, soldered flash storage chip ideal for reliable, compact designs in IoT, industrial controls, automotive, and portable electronics.
