BGA
BGA
64GB/128GB BGA NAND Flash | Stable, cost-effective storage for embedded & smart devices. High-density packaging, reliable performance, ideal for industrial & entry-level consumer electronics.
Our 64GB 128GB BGA NAND flash delivers compact, high-performance storage in a Ball Grid Array package. Designed for soldered-down applications, this high density BGA NAND module provides excellent electrical and thermal performance while maintaining strong mechanical stability under vibration and shock.
Ideal for space-constrained industrial designs, our industrial 64GB BGA NAND and 128GB BGA NAND flash combine advanced NAND technology with robust rugged BGA packaging, ensuring long-term data integrity in demanding environments.Stable operation over 0-70°C temperature range, strong shock/vibration resistance, ensuring reliable data storage and transmission in industrial environments.Get a quote.
High Density BGA NAND Module: Array of solder balls enables higher I/O count in smaller footprint compared to traditional packages.
Wide Temperature BGA NAND: Supports extended operating ranges suitable for industrial use, with stable performance across temperature fluctuations.
High Reliability BGA NAND: Enhanced power integrity, reduced signal interference, and superior heat dissipation for consistent operation.
High Endurance BGA NAND: Optimized for frequent read/write cycles with robust error correction.
Embedded BGA NAND Solution: Perfect for direct PCB mounting, eliminating connector failure risks in vibration-heavy applications.
Our industrial 64GB BGA NAND and 128GB BGA NAND flash are widely adopted in:
Industrial gateways and PLC controllers
Smart sensors and edge computing devices
Automotive electronics modules
Rugged handheld terminals and medical equipment
IoT devices requiring reliable embedded BGA NAND solution
The rugged BGA packaging makes it especially suitable for environments with constant vibration or thermal cycling.
As an experienced China BGA NAND supplier, we offer end-to-end support from custom design and wafer testing to final assembly. Clients benefit from:
Competitive factory-direct pricing
Flexible customization for pin configuration, firmware, and endurance requirements
Short lead times and stable supply chain
Dedicated technical team for custom 64GB 128GB BGA NAND development
We focus on delivering high reliability BGA NAND that meets stringent industrial standards while keeping costs competitive.
Contact us
Looking for reliable 64GB 128GB BGA NAND flash or high density BGA NAND module for your next project?
Contact our BGA specialist today for:
Free technical consultation
Detailed datasheet
Sample availability
Custom quotation
1.Higher Density
Enables more pins and I/O connections in a smaller footprint, crucial for compact electronic devices.
2.Better Thermal Performance
Provides efficient heat dissipation through the bottom solder balls, enhancing chip reliability.
3.Improved Electrical Performance
Reduces inductance and shortens signal paths, supporting higher-speed circuits and stability.
4.Stronger Mechanical Bond
Creates a more robust physical connection to the PCB, improving shock and vibration resistance.
1.Electrical Performance
Provides low inductance and short signal paths, enabling high-speed operation and stable power delivery for modern processors and memory.
2.Thermal Performance
Efficiently transfers heat from the chip to the PCB through the array of solder balls, enhancing overall system reliability and thermal management.
3.Mechanical Performance
Offers a robust, distributed connection to the circuit board, improving resistance to physical stress such as shock, vibration, and thermal cycling.
| Parameter Name | Description |
| Manufacturing process | Attach die, place solder balls, and reflow to form electrical connections. |
| Capacity range | 64GB,128GB,256GB,512GB. |
| Size and packaging | packaging form: may vary depending on application requirements. |
| Operating Temperature | 0-70℃ |
| NAND Flash | TLC/SLC |
| Layout | Layout of solder ball array |
| Center distance of welding ball | 0.4mm~1.27mm |
| Number of welding balls | Dozens to hundreds |
In summary,BGA (Ball Grid Array) is a compact chip package that uses an array of solder balls underneath for connections. It enables high-density, high-performance, and reliable integration for modern processors and memory chips.
