Application
Application
Wearable smart devices have been evolving for decades, tracing their origins back to experimental prototypes in the 1970s and 1980s. Enabled by the growth of the mobile internet and advances in technology—especially in energy-efficient chip design—wearable devices have transitioned from conceptual stages to commercial reality, with innovative models continually entering the market. Today, their research significance and application potential are increasingly evident across diverse fields such as defense, education, entertainment, and beyond.
Through years of focused development, RuiXIN Microelectronics has significantly enhanced the performance of its products for smart wearable applications. In response to growing demand for low-power and compact wearable solutions, multi-chip storage products are seeing wider adoption, meeting industry requirements for applicability, reliability, and compatibility.
SD NAND combines NAND flash, a controller and firmware in a surface-mounted package. The host communicates with it through an SD, SDIO or compatible SPI interface, depending on the selected product and system design.
This architecture is relevant when a wearable-device processor already supports SD-style communication but the product should not use a removable card slot.
A soldered component may be more appropriate when:
Users should not remove the storage
The enclosure must remain compact
There is no space for a card connector
The device must resist movement and repeated handling
Automated SMT production is required
Storage is used for system files rather than manual data transfer
Field replacement is not part of the maintenance plan
The exact package, pin definition, voltage and interface mode must be confirmed before PCB layout.
Wearable products are becoming more capable. Smart glasses, wearable cameras, communication devices and advanced smartwatches may store application software, offline media, AI models, maps, images and local databases.
For these devices, higher-capacity BGA NAND can provide onboard storage without using a removable card or a conventional drive.
Available product directions include:
BGA describes the package type, not one universal storage interface. Before choosing a product, confirm:
Storage interface
Processor compatibility
Ball map
Package dimensions
Package height
Capacity
NAND configuration
Firmware
Operating voltage
Boot requirements
Power-management behavior
Operating temperature
Do not release the PCB layout based only on a capacity description or general BGA product name.
Some wearable products need storage that can be removed after use. Examples include body cameras, wearable sports cameras and portable recorders where files must be transferred independently from the device.
For these applications, a TF card—internationally known as a MicroSD card—may be more practical than soldered storage.
Available capacity pages include:
Choose removable storage when:
Users need to transfer files manually
Storage must be replaced in the field
The device records video or audio
Different capacities are offered for one product platform
A card slot already forms part of the design
The buyer requires a separate branded storage accessory
For continuous video recording, also review the High Endurance MicroSD Card range.
A smartwatch may store:
Operating-system files
Applications
User settings
Watch faces
Activity history
Offline music
Maps
Voice data
Update packages
The storage decision depends on whether the watch runs a lightweight MCU firmware or a larger operating system.
For a basic watch, the priority may be interface simplicity, low standby demand and compact packaging. A more advanced smartwatch may require greater capacity and stronger small-file performance.
Fitness bands commonly generate small, frequent records rather than large files.
Data may include:
Step counts
Heart-rate samples
Sleep data
Exercise sessions
Time stamps
Device status
Synchronization records
These workloads require attention to small-block writing, file rotation and power behavior.
Smart glasses may require larger storage capacity for:
Operating-system resources
Voice-assistant dta
Images
Video
Maps
AI models
Local applications
Training or maintenance content
PCB area, package height and heat management are critical because storage competes with the processor, camera, wireless modules and battery for limited internal space.
BGA NAND may be evaluated where higher capacity is required. The exact interface and package must match the processor platform.
Audio wearables may use embedded memory for:
Firmware
Voice prompts
Language packages
Equalizer settings
User profiles
Diagnostic records
Offline audio
Update staging
The main priorities may include low standby demand, fast wake-up and reliable firmware updates.
Where the device has no need for removable memory, a soldered storage component reduces dependence on a mechanical connector.
These devices create a more intensive sequential-write workload than most watches or fitness bands.
Qualification should consider:
Video resolution
Codec
Bitrate
Recording hours
Loop recording
Audio
Event metadata
Operating temperature
Power interruptions
File-transfer method
Use MicroSD when field removal is required. Consider onboard BGA storage when the memory must remain integrated and tamper-resistant.
Wearable monitoring devices may store sensor records, event logs, user settings and synchronization data.
For regulated products, storage selection and validation must form part of the manufacturer’s complete quality, risk-management and regulatory process. The component should not be described as medical grade unless the exact product, test conditions and required documentation support that claim.
Wearable storage often handles mixed data.
Examples include:
Sensor samples
Time stamps
Activity records
Device status
Settings
Event logs
Frequent small updates can create a different NAND workload from large sequential files.
Examples include:
Firmware
Fonts
Language packages
Watch faces
Audio prompts
AI models
These files may be written during production or firmware updates and then read repeatedly.
Examples include:
Video
Audio recordings
Offline music
Image files
Map packages
These workloads may require greater capacity and higher sustained performance.
Examples include:
Update files
Synchronization buffers
Cached sensor data
Temporary AI files
Your RFQ should identify each data type, its approximate size, update frequency and retention period.
The answer depends on the processor, operating system, storage capacity, PCB area and power requirements. SD NAND can be considered for SDIO- or SPI-based embedded systems, while BGA NAND may be evaluated for platforms requiring higher onboard capacity.
It may replace a card where the host interface is compatible and removable storage is unnecessary. The PCB must be redesigned for the surface-mounted package, and the exact component must be tested before production.
It can be evaluated for smart glasses requiring compact, higher-capacity onboard storage. Confirm interface, package height, thermal conditions, processor compatibility and power requirements before selecting it.
Capacity alone does not determine total power consumption. NAND configuration, controller, firmware, workload, interface and power-state behavior can all affect the result. Test the exact product in the final system.
Send RuiXIN your wearable platform, processor, interface, PCB constraints, power targets, capacity, workload and production forecast. The team can help you compare SD NAND, BGA NAND and removable MicroSD options, define an engineering sample plan and prepare a project-based quotation.
