The core difference lies​ in the physical packaging rather than the storage technology itself. Traditional NAND refers to chips with external pins (like TSOP), while BGA (Ball Grid Array) NAND uses solder balls under the chip. BGA enables significantly higher speeds, better thermal management, and ultra-compact, space-saving designs.

Jiangsu RuiXIN Microelectronics to Highlight Advanced Semiconductor Solutions at electronica China 2026

​Recently, RuiXIN microelectronics officially announced that after several days of rigorous auditing, the company has successfully passed the external audit of the ISO quality management system, marking another recognition by an international authoritative organization for the company's quality management, process control and customer satisfactio

To further enhance employees' fire safety awareness and improve their emergency response capabilities, our company successfully held a fire drill on April 11, 2024.